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ANSYS Electronics Suite 2022 | 8.1 GB

ANSYS电子解决方案可帮助您比以往更快，更经济地设计创新的电气和电子产品。我们行业领先的电磁场，电路，系统和多物理场仿真软件使设计过程完全自动化，因此您可以更好地了解产品的行为方式。您可以使用模拟快速优化设计，而不是浪费时间来构建和测试昂贵的原型。因此，无论是计算机芯片，电路板，手机，汽车电子元件还是整个通信系统，ANSYS软件都可以帮助您设计出更好的产品。

应用

天线
电动机
电子冷却
低频电磁学
电力电子
电力完整性
射频和微波
信号完整性

What's New in ANSYS Electronics 2024

The software developer Ansys is pleased to announce the availability of Ansys Electronics 2024. This solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before.

What's New in Ansys Electronics 2024
General Electronics Desktop
- Ability to query and edit plot properties in non-graphical mode
- Enhancements to fields post processor workflows and displays
- CPython execution of APIs (Beta)
- Intel MPI 2021 (Beta)
- Parasolid kernel for 3D Modeler option (Beta)
- Faster mesh refinement with support for multiple cores (Beta)
HFSS
- 3D Components generalized priority mesh definition
- 3D Layout Component support for Mesh Fusion
- Release of RF Discharge including expanded gas library
- Property API to query profile performance data
- Option to replace FEBI with radiation for adaptive passes
- Lightweight geometry for FEM-MoM Hybrid (Beta)
- Performance enhancements:
. S-matrix post-processing for large matrices
. Reduced adaptive pass memory with large number of excitations
. Reduced frequency sweep memory with auto S-matrix only solutions
. Improved memory monitoring for distributed direct matrix solver
. Direct solver with auto HPC on NUMA (Beta)
. AMD math libraries with the direct matrix solver (Beta)
. Distributed mesh fusion solver with large number of excitations (Beta)
- Improvements to SBR+:
. 3D component array on an SBR+ platform
. Geometrical Optics (GO) blockage model
. Lossy materials' impact included in directivity calculations
. Reporting of simulation ray statistics
HFSS 3D Layout
- Release of encrypted 3D Layout Components
- Enhanced fields post-processing workflows and usability
- Property API to query profile performance data
- Improved XML handling for thermal models
- Rigid flex multizone workflow and meshing (Beta)
- IC Layout Mode (Beta)
- Performance enhancements:
. New auto option to select direct or iterative solver
. Improved Boolean operations for IC geometry
. S-matrix post-processing for large matrices
. Reduced adaptive pass memory with large number of excitations
. Improved memory monitoring in distributed direct matrix solver
. Direct solver with auto HPC on NUMA (Beta)
. AMD math libraries with the direct matrix solver (Beta)
. Distributed mesh fusion solver with large number of excitations (Beta)
SIwave
- SI Xplorer workflow enhancements, including ground net stitching via placement flexibility
- DDR Wizard support for IBIS AMI models
- Advanced coupling algorithm for near/far field simulations
- Improved accuracy of pin group modeling
- Improved accuracy of auto HFSS Regions (Beta)
- CPA enhancements:
. Exposure of Q3D CG solver accuracy level settings
. RLGC matrix reduction
. Wideband Spice model generation (Beta)
- PSI enhancements:
. New DC-IR solver with improved S-parameter accuracy
. DC point calculation available in frequency sweeps
Maxwell
- Magnetic latch modeling co-simulation with Ansys Motion
- Translational motion with contact between moving and stationary parts
- Thin layer and insulation boundaries for 3D AC conduction solver
- Spatial and temporal FFTs display in 2D and 3D transient designs
- Shared memory parallelization of iterative capacitance matrix solution
- Nonlinear materials in electric transient solver
- Export equivalent circuits from a 2D design with skew
- Core loss based three-phase induction machine
- ROM MPI improved performance of skew modeling with Simplorer co-simulation
- Setting model depth in 2D magnetostatic designs
- Property API to query profile performance data
- Multiphysics enhancements:
. Export element-based harmonic force
. Computing harmonic force in partial simulation of full model
. Improvements to calculation of surface force and force density
. Output object-based solid loss and core loss from 3D TDM solutions
. Output object and phase-based loss from transient and eddy solutions
- Machine toolkit enhancements:
. Generalized sweep points in efficiency map generation
. Continue prior analysis with additional sweep points
Icepak
- Commercial release of streamline plotting
- Improved performance and accuracy of HD meshing
- Support for fin parameters in heat sink models
- Transfer of thermal solutions to Sherlock
- PCB IDF import support for drill holes and cutouts
- Support for CTM 2.0 models, including encrypted stackup data (Beta)
- Automated Icepak design creation from HFSS, Maxwell, and Q3D (Beta)
- Support for Delphi ROM creation of QFP packages (Beta)
- Slack setting capability for mesh region creation (Beta)
- Enhancements to Classic Icepak import and translation
- Improved scripting API for property queries and edits
Mechanical
- Convergence controls for non-linear solutions
- Ability to include heat flow rate in field summary
- Support for thermal contacts (Beta)
- Automated Mechanical design creation from HFSS, Maxwell, and Q3D (Beta)
- Enhancements for Structural solution type (Beta):
. Improved slider bar meshing
. Ability to calculate reaction forces in fields summary
- Improved scripting API for property queries and edits
Q3D Extractor
- Uniform temperature-dependent materials for CG solver
Circuit
- Encrypted Verilog-A models
- Improved handling and logging of Transient solver settings
- ESD and EFT source components
- Modeling support for PAM4 and DC_Offset keywords for IBIS/AMI in SPISim
- S-Parameters post-processing based on OIF specifications in SPISim
- COM implementation updated to reference v2.95 in SPISim
- Channel Operating Margin (COM) optimization in SPISim (Beta)
EMIT
- Results window enhancements:
. Project information
. Toggle plots of power spectrum at any point in the Tx/Rx chain
. Identification of the root cause of saturation from the contributors list
- Support for arbitrary shapes in Tx/Rx measurement import
- Import antenna positions from Discovery/SpaceClaim
Twin Builder
Export and Scaled Deployment
- Fusion Modeling (Beta)
- Hybrid Calibration workflow enhancements
- Twin Deployer workflow enhancements
- PTC Agent updated to latest TWX platform and Java version
- Support for Ubuntu OS (Twin Deployer and Runtimes)
- Enhanced Twin compilation debugging information
Reduced Order Model
- Error prediction in Static ROM Builder
- ROM Viewer: Cut-plane specification based on normal input
- Comparison of fields in Dynamic ROM Builder
Modelica Enhancements
- Automatic connector sizing support
- Improved diagram graphics
- Initial bijection support (Text to Diagram)
- Show relevant parameters with dialog box annotation
- Show Modelica text/diagram/doc from Text Editor
Solver and Model Library
- Toshiba Electric Power Steering System Library (Accu-ROM)
- Sparse matrix support when exporting FMU from SML model (LTI)
- ECM fitting algorithm update
- Battery Wizard enhancements
General Enhancements
- Improvements to resizing/moving pins on sub-sheet symbols
- Initial support for Twin Builder automation with pyAnsys/pyAEDT

Selected Defect Corrections
Circuit
- 549720 – Cutting a Circuit design and pasting as a subcircuit no longer causes crashwhen saving project.
- 576182 – Network Data Explorer successfully runs Causality Checker.
- 602596 – Removed 32-bit SPISim AMI library from distribution.
- 615377 – Removed log4j library dependency from SPISim and Electronics Desktop.
HFSS
- 508809 – Running Optimetrics and applying to nominal now generates the same result ifthe normal variation is re-solved.
- 553470 – VRT launched from antenna source is now correct for NF linked design in SBR+solution type.
- 620869 – Field calculator now exports correct value in angle for Cylindrical and Sphericalcoordinates.
Icepak
- 555948 – Multiple 3D dataset assignments are now supported.
556392 – Metal fractions are now correctly displayed for all trace geometries.
- 590724 – Warning messages are now shown if SIwave power profiles are included inClassic Icepak model imports.
Maxwell
- 527057 – In Maxwell 3D (Transient solver) CoreLoss, StrandLoss and SolidLoss nowsupport TDM.
Q3D Extractor
- 457625 – Q3D results now correct if parametric sweep runs with the same mesh fordifferent material.
- 592679 – Accuracy improvements to reduced capacitance matrix computation.
SIwave
- 476212 – Improvements to AEDT–Icepak project configuration in SIwave DCIR–Thermalworkflow.
- 508722 – RLCG table and HTML report now match.
- 594203 – Robust recovery from license server connectivity issues during SIwavesimulation.
- 621218 – Improvements to SIwave DCIR field post-processing for simulations involvinglow-valued sources.
Twin Builder
- 612892 – Modelica interface selections are now retained when compiling.
- 614414 – Certain component symbols no longer shift in position when read from a definition archive.

Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines.

Product: ANSYS Electronics
Version: 2024
Supported Architectures: x64
Website Home Page : www.ansys.com
Language: english
System Requirements: PC *
Supported Operating Systems: *
Size: 9.4 Gb

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