[行业软件]Cadence Design Systems Sigrity 2018.04 [复制链接]

Cadence Design Systems, has launched the hotfix 4 for Cadence Sigrity 2018 release. The 2018 release includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance.
的需求日益增加，更快的处理器必然需要更高的处理速度和更高的频率。随着信号速度的提高，更准确地说，PCB板或多层板上嵌入式路径中的信号移动，如果工程师设计不当，会出现干扰，失真和干扰等新事件和问题。高频噪声和......会对信号健康造成威胁。为了最大限度地减少这些威胁，对其进行补偿并提高高速电路的质量，我们需要Allegro Sigrity软件完成分析和修复工作。该软件将IC和PCB的设计，编辑和布线技术与Cadence®Allegro®相结合，可在布局前和布局后进行高级分析。
该软件通过在相同的设计早期阶段检查不同的场景，最大限度地降低了精度和重新设计。该软件可以直接读写Allego的PCB和IC设计数据库。它提供了一个用户友好的基于SPICE的模拟器以及一个内置求解器来提取二维和三维结构。该软件还支持晶体管级建模和功能输出输入，包括功耗感知IBIS 5.0。

Cadence Design Systems Sigrity 2018 Hotfix 18.00.004 Release Notes:






Cadence Sigrity 2018 release includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance. A unique, 3D design and 3D analysis environment integrating Sigrity tools with Cadence Allegro technology provides a more efficient and less error-prone solution than current alternatives utilizing third-party modeling tools, saving days of design cycle time and reducing risk. In addition, a new 3D Workbench methodology bridges the gap between the mechanical and electrical domains, allowing product development teams to analyze signals that cross multiple boards quickly and accurately.

Since many high-speed signals cross PCB boundaries, effective signal integrity analysis must encompass the signal source and destination die, as well as the intervening interconnect and return path including connectors, cables, sockets and other mechanical structures. Traditional analysis techniques utilize a separate model for each piece of interconnect and cascade these models together in a circuit simulation tool, which can be an error-prone process due to the 3D nature of the transition from the PCB to the connector. In addition, since the 3D transition can make or break signal integrity, at very high speeds designers also want to optimize the transition from the connector to the PCB or the socket to the PCB.

The Sigrity 2018 release enables designers to take a holistic view of their system, extending design and analysis beyond the package and board to also include connectors and cables, all of which can impact optimization of the high-speed interconnect. An integrated 3D design and 3D analysis environment allows PCB design teams to optimize the high-speed interconnect of PCBs and IC packages in the Sigrity tool and automatically implement the optimized PCB and IC package interconnect in Allegro PCB, Allegro Package Designer, or Allegro SiP Layout without the need to redraw. Until now, this has been an error-prone, manual effort requiring careful validation. By automating this process, the Sigrity 2018 release reduces risk, saves designers hours of re-drawing and re-editing and can save days of design cycle time by eliminating editing errors not found until the prototype reaches the lab. This reduces prototype iterations and potentially saves hundreds of thousands of dollars by avoiding re-spins and schedule delays.

A new 3D Workbench utility available with the Sigrity 2018 release bridges the mechanical components and the electronic design of PCB and IC packages, allowing connectors, cables, sockets and the PCB breakout to be modeled as one with no double counting of any of the routing on the board. Interconnect models are divided at a point where the signals are more 2D in nature and predictable. By allowing 3D extraction to be performed only when needed and fast, accurate 2D hybrid-solver extraction to be performed on the remaining structures before all the interconnect models are stitched back together, full end-to-end channel analysis can be performed efficiently and accurately of signals crossing multiple boards.

In addition, the Sigrity 2018 release offers Rigid-Flex support for field solvers such as the Sigrity PowerSI® technology, enabling robust analysis of high-speed signals that pass from rigid PCB materials to flexible materials. Design teams developing Rigid-Flex designs can now use the same techniques previously used only on rigid PCB designs, creating continuity in analysis practices while PCB manufacturing and material processes continue to evolve.

Sigrity technologists guide you step by step on how to design and verify your automotive Ethernet serial links using the Sigrity serial link analysis methodology. Simulating and verifying your designs meet compliance standards before you go to the lab will reduce design re-spins saving significant time and money. Ensure your automotive module will hit the market ahead of your competitors.







Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.

Product: Cadence Design Systems Sigrity
Version: 2018.04
Supported Architectures: x64
Website Home Page : www.cadence.com
Language: english
System Requirements: PC *
Supported Operating Systems: *
Size: 6.8 Gb





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